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Time of issue:2020-03-17 00:00:00

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Copper molybdenum copper

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Copper molybdenum copper

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ee02

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Tungsten copper

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Copper molybdenum copper:
　　Copper molybdenum copper packaging material (CMC) is a sandwich structured flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides.
　　Besides, CMC has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability. The production process of it commonly uses method of rolling composite, plated composite and explosive forming. CMC is mainly used as the bottom expansion and thermal conductivity channel of the heat sink, the lead frame and the multilayer printed circuit board (PCB).

Type	Materials	Density (g/cm³)	Thermal Conductivity W/moK	CTE, ppm/°K 20-100℃
Copper Metallaminate	1:1:1 Cu/Mo/Cu	9.27-9.47	300-310(x-y) 220-230(z)	9.6-10.0
	1:2:1 Cu/Mo/Cu	9.48-9.68	270-280(x-y) 200-210(z)	8.5-8.9
	1:3:1 Cu/Mo/Cu	9.6-9.8	240-250(x-y) 180-190(z)	7.7-8.1
	1:4:1 Cu/Mo/Cu	9.7-9.9	210-220(x-y) 170-180(z)	6.8-7.2
	1:5:1 Cu/Mo/Cu	9.74-9.94	195-200(x-y) 165-170(z)	6.2-6.6
	13:74:13 Cu/Mo/Cu	9.78-9.98	210-220(x-y) 220-230(z)	5.7-6.1
	1:7:1 Cu/Mo70/Cu	9.46	300-310(x-y) 170-180(z)	7.2

Keyword:

Copper molybdenum copper

CMC

Cu/Mo/Cu

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