Molybdenum Copper is a composite material of molybdenum and copper and its performance is similar with copper tungsten, which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper is more suitable for aerospace and other fields. Since the Mo-Cu material has no adhesive agent, and the material has a high thermal conductivity, thermal expansion coefficient, these properties are well matched with ceramic material and a semiconductor material for the electronics industry. Molybdenum Copper material is more ablative, more plastic and workable than molybdenum, so it can be used as high-temperature parts for the rockets and missiles in lower temperature, and it can also replace the molybdenum as the components in the other weapons. The high-power integrated circuits and microwave integrated device require high thermal conductivity conductive material as the conductive radiating element, and they require vacuum and thermal properties and thermal expansion coefficient as well. The molybdenum copper is the preferred material as it meets these requirements.