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Details
copper molybdenum copper heat sink
Release time:
2020-06-01
Source:
Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.Thanks to the relatively low Coefficient of thermal expansion and thermal conductivity that is far better than the WCu and MoCu, it provides better alternative for high power electronic components by cooling high-power IGBT modules and other components.
Physical Properties:
| Grade | Density g/m³ | Coefficient of thermal expansion at 20℃ | Thermal conductivity at W/(M.K) |
| CMC111 | 9.32 | 8.8 | 305(XY)/250(Z) |
| CMC121 | 9.54 | 7.8 | 260(XY)/210(Z) |
| CMC131 | 9.66 | 7 | 244(XY)/190(Z) |
| CMC141 | 9.75 | 6 | 220(XY)/180(Z) |
| CMC13/74/13 | 9.88 | 5.6 | 200(XY)/170(Z） |
Application:
Heat sink, lead frame, PCB,IGBT modules, RF, microwave and high-power semiconductor devices.
Picture:
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