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Details
copper/molybdenum copper/copper heat sink
Release time:
2020-06-08
Source:
Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
Physical Properties:
| grade | density g/m³ | coefficient of thermal expansion at 20℃ | Thermal conductivity W/(M.K) |
| CPC141 | 9.5 | 7.3 | 211 |
| CPC232 | 9.3 | 7.5 | 250 |
| CPC111 | 9.2 | 9.5 | 260 |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages,GaAs device mount.
Product picture:
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