Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density,which makes it a great alternative to tungsten copper for weight sensitive applications. 

Features:

High thermal conductivity due to no sintering additives was used;

Excellent hermeticity;

Relatively small density;

Stampable sheets available (Mo content not more than 75wt%);

Semi-finished or finished (Ni/Au/Ag plated) parts available;

Physical Properties:

Application:

These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

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