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Time of issue:2020-03-17 00:00:00

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molybdenum copper heat sink

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molybdenum copper heat sink

  • Categories:News
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  • Time of issue:2020-05-25 15:02
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(Summary description)

molybdenum copper heat sink

(Summary description)

  • Categories:News
  • Author:
  • Origin:
  • Time of issue:2020-05-25 15:02
  • Views:
Information

Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density,which makes it a great alternative to tungsten copper for weight sensitive applications. 

Features:

High thermal conductivity due to no sintering additives was used;

Excellent hermeticity;

Relatively small density;

Stampable sheets available (Mo content not more than 75wt%);

Semi-finished or finished (Ni/Au/Ag plated) parts available;

 

Physical Properties:

Material Wt%  moly content g/m³ Density  at 20℃ Thermal conductivity at 25℃ Coefficient of thermal expansion at 20℃  
Mo85Cu15 85±2 10 195 7
Mo80Cu20 80±2 9.9 204 7
Mo70Cu30 70±2 9.8 208 7.3
Mo60Cu40 60±2 9.66 223 8.4
Mo50Cu50 50±2 9.5 230 10.2

 

Application:

These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

 

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