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molybdenum copper heat sink
- Categories:News
- Author:
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- Time of issue:2020-05-25 15:02
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(Summary description)
molybdenum copper heat sink
(Summary description)
- Categories:News
- Author:
- Origin:
- Time of issue:2020-05-25 15:02
- Views:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density,which makes it a great alternative to tungsten copper for weight sensitive applications.
Features:
High thermal conductivity due to no sintering additives was used;
Excellent hermeticity;
Relatively small density;
Stampable sheets available (Mo content not more than 75wt%);
Semi-finished or finished (Ni/Au/Ag plated) parts available;
Physical Properties:
Material | Wt% moly content | g/m³ Density at 20℃ | Thermal conductivity at 25℃ | Coefficient of thermal expansion at 20℃ |
Mo85Cu15 | 85±2 | 10 | 195 | 7 |
Mo80Cu20 | 80±2 | 9.9 | 204 | 7 |
Mo70Cu30 | 70±2 | 9.8 | 208 | 7.3 |
Mo60Cu40 | 60±2 | 9.66 | 223 | 8.4 |
Mo50Cu50 | 50±2 | 9.5 | 230 | 10.2 |
Application:
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
Picture:
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