Details

Molybdenum Copper Heat Sink




Key words:

MoCu

Moly Copper

MoCu heat sink

MoCu flange

Molybdenum Copper


Product Description


Description:

Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Advantages:

1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade

Mo Content

Density g/cm3

Coefficient of thermal

Expansion ×10-6  (20℃)

Thermal conductivity W/(M·K)

70MoCu

70±2%

9.8

7

200(25℃)/196(100℃)

60MoCu

60±2%

9.66

7.5

222(25℃)/217(100℃)

50MoCu

50±2%

9.5

10.2

250(25℃)/220(100℃)

 

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.