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Time of issue:2020-03-17 00:00:00

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Copper Tungsten Heat Sink

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Copper Tungsten Heat Sink

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Description:

Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.

Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.

The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.

Advantages:

1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

4. Semi-finished or finished (Ni/Au plated) products available

5. Low porosity

Product Properties:

Grade

W Content

Density g/cm3

Coefficient of thermal

Expansion ×10-6  (20℃)

Thermal conductivity W/(M·K)

90WCu

90±2%

17.0

6.5

180 (25℃) /176 (100℃)

85WCu

85±2%

16.4

7.2

190 (25℃) / 183 (100℃)

80WCu

80±2%

15.65

8.3

200 (25℃) / 197 (100℃)

75WCu

75±2%

14.9

9.0

230 (25℃) / 220 (100℃)

50WCu

50±2%

12.2

12.5

340 (25℃) / 310 (100℃)

 

Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Keyword:
tungsten copper
tungsten copper heat sink
WCu
WCu heat sink
WCu flange
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