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Cu-Diamond/Al-Diamond
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Product Description
Cu-Diamond/Al-Diamond
Metal-based diamond composite materials mainly include aluminum diamond and copper diamond, which are a type of composite material with high thermal conductivity metals such as aluminum or copper as the matrix and diamond particles as functional members. The composite material is with ultra-high thermal conductivity and a low thermal expansion coefficient.The corresponding thermal conductivity and thermal expansion coefficient can be adjusted according to the ratio of diamond and copper. It is an extremely excellent heat-dissipation material with main applications in power semiconductor packaging, military microwave RF and other fields.
Cu-Diamond properties:
|
Product type |
Thickness |
Surface metal |
R.T. Thermal conductivity (W/m.K) |
25℃~125℃ Coefficient of thermal expansion（×10-6/℃） |
Bending strength（/MPa） |
Outstanding features of product |
|
Plate |
0.3~1.0mm |
Copper matrix |
350~500 |
6.5±0.5 |
>240 |
1) The thickness of the surface metal layer is 0.1~0.15mm; 2) When the surface metal layer is copper matrix, the maximum temperature resistance of the electroplating nickel layer is 550℃; When the surface metal layer is WCu or MoCu, the maximum temperature resistance of the electroplated nickel layer is 850℃; 3) The surface roughness can reach 0.1μm; 4) The product structure design can be carried out according to the conventional tungsten copper and molybdenum copper product specifications,complex shape is available. 5) The product can withstand the temperature of -55℃~125℃ temperature cycle 1000 times with thermal conductivity change rate not exceed 5%. |
|
1.0~2.0mm |
Copper matrix、WCu、MoCu |
500~600 |
6.0±0.5 |
>240 |
||
|
2.0~3.0mm |
600~700 |
（5.0~6.0）±0.5 |
>260 |
|||
|
>3.0mm |
>720 |
|
>280 |
|||
|
Cylindrical |
|
WCu、MoCu |
>720 |
（5~6.0）±0.5 |
>280 |
|
|
Pinfin |
>3.0mm |
Copper matrix、WCu、MoCu |
>720 |
（5~6.0）±0.5 |
>280 |
Al-Diamond properties:
|
Product type |
Thickness |
Surface |
R.T. Thermal conductivity W/m.K |
25℃~125℃ Coefficient of thermal expansion（×10-6/℃） |
Bending strength（/MPa） |
Outstanding features of product |
|
Plate or Plate with steps |
0.3~1.0mm |
Aluminum Matrix |
300~450 |
7.0±0.5 |
>240 |
1) The surface layer thickness is 0.1~0.15mm; 2) The maximum temperature resistance of the surface electroless nickel plating is up to 450℃; 3) The surface roughness can reach 0.4μm; 4) The product structure design can be carried out according to the conventional tungsten copper and molybdenum copper product specifications,complex shape is available. 5) The product can withstand the temperature of -55℃~125℃ temperature cycle 1000 times with thermal conductivity change rate not exceed 10%. |
|
1.0~2.0mm |
Aluminum Matrix、 AlSiC |
450~550 |
7.0±0.5 |
>240 |
||
|
2.0~3.0mm |
500~600 |
（6.0~7.0）±0.5 |
>260 |
|||
|
>3.0mm |
>620 |
（6.0~7.0）±0.5 |
>280 |
|||
|
Plate with steps or Cylindrical |
>3.0mm |
AlSiC |
>620 |
（6.0~7.0）±0.5 |
>280 |
|
|
Pinfin |
>3.0mm |
Aluminum Matrix、 AlSiC |
>620 |
（6.0~7.0）±0.5 |
>280 |
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