

banner01

了解更多

banner02

了解更多





All categories



侧边栏

Time of issue:2020-03-17 00:00:00

Tel：086-731-22868219
Fax：086-731-28415766
Erin: 13873213272
Email : sales@chinatungstens.com
Address：No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, P.R. China.

Your present location:

Homepage

/

Products

/

Electronic Packaging Materials

/

85MoCu carrier

Describe

1/1

Number of views:

1094

85MoCu carrier

Retail price

0.0

元

Market price

0.0

元

Number of views:

1094

Product serial number

Mo85Cu15

Category

Electronic Packaging Materials

Quantity

-

+

Stock:

0



1

describe

Description:

Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Advantages:

1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade	Mo Content	Density g/cm³	Coefficient of thermal Expansion ×10^-6(20℃)	Thermal conductivity W/(M·K)
70MoCu	70±2%	9.8	7	200（25℃）/196（100℃）
60MoCu	60±2%	9.66	7.5	222（25℃）/217（100℃）
50MoCu	50±2%	9.5	10.2	250（25℃）/220（100℃）

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Keyword:

MoCu

Moly Copper

MoCu heat sink

MoCu flange

Molybdenum Copper

Scan the QR code to read on your phone