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Cu/MoCu/Cu (CPC141) Heat dissipation material




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Product Description


Description:

Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.

Product Properties:

Grade

Density g/cm3

Coefficient of thermal

Expansion ×10-6  (20℃)

Thermal conductivity W/(M·K)

CPC141

9.5

7.3

280XY/170Z

Application:

Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.