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        • Product Name  Copper molybdenum copper
        • Views   268

                     

         

        Copper molybdenum copper:
          Copper molybdenum copper packaging material (CMC) is a sandwich structured flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides.
          Besides, CMC has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability. The production process of it commonly uses method of rolling composite, plated composite and explosive forming. CMC is mainly used as the bottom expansion and thermal conductivity channel of the heat sink, the lead frame and the multilayer printed circuit board (PCB).

         

         

        Type

        Materials

        Density
        (g/cm³)

        Thermal Conductivity
        W/moK

        CTE,
        ppm/°K
        20-100℃

        Copper Metallaminate

        1:1:1
        Cu/Mo/Cu

        9.27-9.47

        300-310(x-y)
        220-230(z)

        9.6-10.0

        1:2:1
        Cu/Mo/Cu

        9.48-9.68

        270-280(x-y)
        200-210(z)

        8.5-8.9

        1:3:1
        Cu/Mo/Cu

        9.6-9.8

        240-250(x-y)
        180-190(z)

        7.7-8.1

        1:4:1
        Cu/Mo/Cu

        9.7-9.9

        210-220(x-y)
        170-180(z)

        6.8-7.2

        1:5:1
        Cu/Mo/Cu

        9.74-9.94

        195-200(x-y)
        165-170(z)

        6.2-6.6

        13:74:13
        Cu/Mo/Cu

        9.78-9.98

        210-220(x-y)
        220-230(z)

        5.7-6.1

        1:7:1
        Cu/Mo70/Cu

        9.46

        300-310(x-y)
        170-180(z)

        7.2