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Time of issue:2020-03-17 00:00:00

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copper/molybdenum copper/copper heat sink

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copper/molybdenum copper/copper heat sink

  • Categories:News
  • Author:
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  • Time of issue:2020-06-08 14:16
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(Summary description)

copper/molybdenum copper/copper heat sink

(Summary description)

  • Categories:News
  • Author:
  • Origin:
  • Time of issue:2020-06-08 14:16
  • Views:
Information

Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

 

Physical Properties:

grade density g/m³ coefficient of thermal expansion at 20℃ Thermal conductivity W/(M.K)
CPC141 9.5 7.3 211
CPC232 9.3 7.5 250
CPC111 9.2 9.5 260

 

Application:

Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages,GaAs device mount.

 

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