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copper/molybdenum copper/copper heat sink

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copper/molybdenum copper/copper heat sink

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Time of issue:2020-06-08 14:16
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(Summary description)

copper/molybdenum copper/copper heat sink

(Summary description)

Categories:News
Author:
Origin:
Time of issue:2020-06-08 14:16
Views:

Information

Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

Physical Properties:

grade	density g/m³	coefficient of thermal expansion at 20℃	Thermal conductivity W/(M.K)
CPC141	9.5	7.3	211
CPC232	9.3	7.5	250
CPC111	9.2	9.5	260

Application:

Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages,GaAs device mount.

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